Austrochip 2023 will be held from September 20-21, 2023. The first day will provide three workshops. The second day will hold the conference including two keynote talks and three paper sessions.
This is the program of the workshops on the first day of Austrochip 2023. For more details click on the respective items or expand or collapse all.
AbstractIC design has changed in the recent years, where in the past silicon solutions were integrated in bigger systems the trend now is towards integration of systems in systems. State of the art deep sub-micron technologies allow millions of transistors to be integrated on a few mm2. This leads to very complex systems containing Analog (sensing/acting), Digital(DSP, Uc and Memory) and Software (firmware and application) all in one die. The challenge is to bring these disciplines together in a timely manner and without errors, as silicon re-spins are extremely costly. Therefore within the semiconductor industries theme's like "shift left" and "virtual prototyping" are driving more and more the development of semiconductors. There is a trend to enable customers early with a sneak preview, by means of models, to help them to start prototyping months before the silicon is available.
About the SpeakerBoris Mueller was born in Freiburg, Germany, in 1979. He holds a Master's degree in Electrical Engineering and Audio Engineering(Dipl.-Ing.) from the Technical University of Graz. After working in the field of acoustics and sound reinforcement for several years he joined NXP Semiconductors to focus on the second part of his professional career. He started in 2012 as a contractor and became an expert in behavioral modelling. In 2016 with the establishment of the modelling team he became a full-time employee. Since 2017, Boris Mueller is involved in RF & LF automotive R&D projects, working as integrator and modelling engineer.
Workshop II: Combined Effects on Chip Level EMC: Ionizing Radiation, Functional Safety and Ageing
AbstractTechnology scaling, which made electronics accessible and affordable for almost everyone on the globe, has advanced integrated circuits (ICs) and electronics since sixties. Nevertheless, it is well recognized that such scaling has introduced new (and major) reliability challenges to the semiconductor industry. This tutorial addresses the background mechanisms impacting reliability of ICs. In more detail, topics such as the basics about electromagnetic compatibility (EMC) and ionizing radiation, the mechanisms by which they affect ICs, the current standards and laboratory test setup for EMC, total-ionizing dose (TID) and single-event effects (SEEs) on ICs are presented and their combined effects on the reliability of modern ICs are discussed. Moreover, reliability failure mechanisms for (ionizing and non-ionizing) radiation, the way they are modeled and how they are impacting IC lifetime will be covered. Laboratory test setup and recent results from experimental measurements are described. Classic design solutions to counteract with TID, SEEs and EMI in VDSM ICs as well as the recent achievements on the development of on-chip sensors to monitor electromagnetic conducted noise on IC power supply lines of ICs are introduced. A YouTube video is presented to illustrate the effectiveness of such on-chip sensors. Finally, Spice simulations are used to demonstrate the combined effect of ionizing radiation with power supply noise on SRAM cells followed by the presentation of some measures to counteract with it.
About the SpeakersBernd Deutschmann received his M.Sc. degree and the Ph.D. degree in telecommunication engineering from the Graz University of Technology/Austria in 1999 and 2002, respectively. After his studies, he worked in the semiconductor industry from 2000 to 2014 on improving the electromagnetic compatibility (EMC) of integrated circuits. In 2014, he returned to academia and moved to Graz University of Technology/Austria as a full professor for "Electronics" and since then heads the Institute of Electronics. His research area is the design of electronic systems and integrated circuits with a special focus on their electromagnetic compatibility. As part of his research activities, he has filed several patents and authored and co-authored numerous papers and technical articles.
Nikolaus Czepl has received the B.Sc. degree and the M.Sc degree in electrical engineering from Graz University of Technology, Graz, Austria, in 2016 and 2018, respectively., He is working towards his PhD degree at Graz University of Technology as university assistant at the Institute of Electronics (IFE). His research interests are robust analog circuit design and combined effects of ionzing radiation and electromagnetic compatibility.
Daniel Kircher is an electrical engineer who completed his B.Sc. and M.Sc. degrees in Electrical Engineering at Graz University of Technology, Austria. Currently, he is working towards his PhD at Graz University of Technology as a university project assistant at the Institute of Electronics (IFE). Daniel's research interests revolve around the combined effects of EMC, functional safety, and EMI robust analog circuit design.
AbstractContactless position sensors can be found in a wide range of automotive, industrial, medical and consumer applications. From high speed sensors in electric motors or vehicle wheel speed sensors to precise position sensors for robot arms, steering wheels, pedals, valves, actuators, and so forth.
While the majority of these sensors used to be based on magnetic, optical or resolver technologies, there is a growing need for position sensors based on inductive technology due to their low overall cost and inherent robustness towards unwanted magnetic stray fields.
Another beneficial feature is their flexibility in adapting them to the mechanical needs of the application, as the actual sensing element is a simple set of coils printed on a PCB, designed and shaped by the user.
This workshop describes the physical fundamentals behind the inductive position sensing technology, followed by the electrical implementation in building a robust contactless position sensor on chip level. It outlines the design requirements for the printed sensor coils and an overview of the applications that can be utilized with this technology.
Life demos of inductive position sensor applications allow the students to see and experiment with inductive position sensors in operation.
About the SpeakerJosef Janisch has a 35+ year experience in the semiconductor industry from employment in Austria and USA. Starting his career in the wafer fab at AMS, Unterpremstätten, Austria in the late 1980's, he moved to USA in the early 2000's, supporting customers in Canada, North and South America as a field application engineer (FAE). In 2010 he started working as a product manager for ZMDI (Zentrum Mikroelektronik Dresden, Germany) where he started a new product line, focusing on contactless position sensing IC development and opened an office in Ilz, Austria in early 2015. The location has meanwhile grown to 11 employees in Austria and 5 more in Germany, USA and China. ZMDI got acquired by IDT (Integrated Device Technologies, USA) in late 2015, followed by the acquisition of IDT by Renesas (Japan) in 2019. In his current position as senior manager he is leading the research and innovation activities for position sensors at the Renesas Ilz location.
Please register for the dinner when registering for the conference in the ConfTool.
September 20, 2023
18:30 - open end
This is the program of the conference on the second day of Austrochip 2023. For more details click on the respective items or expand or collapse all.
Keynote I: Perspectives of the 28nm CMOS node for front-end electronics in HEP applications
AbstractDetectors of future High Energy Physics (HEP) experiments will require advanced pixel readout processors to be operated in environments with unprecedented levels of radiation and particle rates. The 28 nm CMOS process is the major commercial successor of the 65 nm one, widely used for the design of advanced ASICs in the field of instrumentation for radiation detectors in high energy physics experiments in view of the so-called Phase 2 upgrade of the Large Hadron Collider (LHC). The HEP community is now migrating to the 28 nm process for the design of readout electronics for pixel detectors and other mixed-signal circuits. This CMOS node, in addition to having a clear advantage in the integration density of digital blocks and operation speed, has been thoroughly characterized in terms of radiation hardness showing very promising results. But besides these benefits, process tricks introduced in nanoscaled technologies might show some drawbacks affecting the analog parameters of the devices such as noise performance and leakage currents. In this talk, the main device parameters of the 28 nm CMOS node with a particular focus on gain and noise, together with the most recent designs of analog building blocks developed for future mixed-signal front-end ASICs will be presented and discussed.
About the SpeakerGianluca Traversi is an associate professor of electronics with the University of Bergamo, Department of Engineering and Applied Sciences. He is a Senior Member of the IEEE and a technology research fellow with the Italian Institute for Nuclear Physics (INFN). His professional expertise is in the fields of the design of front-end circuits for radiation detectors, of the study of noise in electronic devices and circuits, and of the development of instrumentation for solid-state device and circuit characterization. Gianluca Traversi is author or coauthor of more than 200 among papers published in scientific journals and conference proceedings.
- An Open-Source 1.44-MS/s 703-μW 12-bit Non-Binary SAR-ADC Using 448-aF Capacitors in 130-nm CMOS
Manuel Moser, Patrick Fath, Georg Zachl, Harald Pretl
A 0.48-THz Fully-Differential FMCW Radar Transceiver in 90-nm SiGe BiCMOS
Christoph Mangiavillano, Alexander Kaineder, Andreas Stelzer
A Low-Noise Low-Power Inductor-Less Self-Biased 50 Gbps TIA in 130nm SiGe BiCMOS
Behnam Abdollahi, Horst Zimmermann
Phase-independent maximum modulation level extraction in IQ receivers
Shuli Chi, Sammy Johnatan Carbajal Ipenza, Ulrich Muehlmann
AbstractElectronic integrated circuits (ICs) have drastically influenced our society over the past decades and have become an indispensable part of our everyday life. A central aspect for applications is long-term failure-safe and stable operation which depends on the robustness, i.e., the high performance and reliable operation, of the microelectronic components employed in these circuits. The requirements for the electronics are thereby strongly application-dependent. For instance, for analog applications low intrinsic noise of the electronics is critical. For SiC power transistors, as used for instance in photovoltaic cells, and automotive applications, high carrier mobility is key to reducing losses in power conversion applications. However, electronic devices suffer from time-zero and time-dependent variability in their performance, which must be investigated in detail for these effects to be considered at an early stage of the circuit design process. The root cause for the non-ideality effects of integrated transistors lies in imperfections at the atomic level, which can emerge as electrically active sites, so-called defects. These defects can become charged during operation, thereby altering the device's characteristics. It should also be noted that device and circuit variability considerably increases for scaled technology nodes.
This talk addresses the challenges of robust electronic circuits, the most important properties affecting the reliability of FETs, and the variability issues in integrated circuits. The manner in which non-ideality effects alter the behavior of devices and circuits will be discussed, and the means by which they can be considered in circuit models and simulators will be described. Furthermore, various characterization techniques and measurement tools that have been developed and employed for their characterization will be presented. Finally, a brief outlook of future research in the direction of performance optimization of electrical circuits made from Si and SiC devices, but also devices based on novel 2D materials is presented in this talk.
About the SpeakerDr. Waltl is an Associate Professor at the TU Wien, Vienna, Austria, and an IEEE Senior Member. His overall scientific focus is on the robustness of microelectronic devices and circuits. In this field, he investigates reliability issues – characterization and modeling – in semiconductor devices and circuits. Furthermore, Dr. Waltl has a strong background in measurement technology and is leading the development of novel characterization tools and techniques. He is the co-author or author of over 100 articles in journals and conference proceedings (h-index 26). Dr. Waltl is the director of the Christian Doppler Laboratory for single defect spectroscopy in semiconductor devices and leads the device characterization laboratory at the Institute for Microelectronics at the TU Wien. In addition, he is the principal investigator of several research projects funded by the FFG and has ongoing collaborations with various industrial partners, including ams-OSRAM AG, Infineon, and imec. He is the (co-)recipient of four best paper awards (IIRW2014, DRC2019, IIRW2019, IEDM2019), serves on the technical program and management committee of various international conferences and workshops, and is Associate Editor with the Microelectronics Engineering journal. Based on his expertise, Dr. Waltl is regularly invited as a reviewer of numerous renowned Journals, including IEEE TED, Microelectronics Reliability, Journal of Applied Physics, and many more.
A Modular Approach of an Electromagnetic Compatibility Test System for Integrated Circuits
Daniel Kircher, Bernd Deutschmann, Simon Profanter
Analysis and Compensation of Stress Effects on CMOS Reference Current Sources
Andro Žamboki, Leo Gočan, Josip Mikulić, Gregor Schatzberger, Tomislav Marković, Adrijan Barić
Nanoscale CMOS Ring Oscillators for Statistical Characterization of Random Telegraph Noise
Semih Ramazanoglu, Alicja Michalowska-Forsyth, Bernd Deutschmann
Impact of Power Supply Arrangement on Electromagnetic Emission from ICs
Bernd Deutschmann, Nikolaus Juch
- Asynchronous HW-Implementation of IEC 61499
Martin Resetarits, Florian Huemer, Andreas Steininger
- Readout of Detectors for Particle Physics Experiments
Simon Waid, Jürgen Maier, Philipp Gaggl, Andreas Gsponer, Patrick Sieberer, Maximilian Babeluk, Thomas Bergauer
BAG2 Assisted Hierarchical Analog Layout Synthesis for Planar Technologies
Matthew Bio, Wolfgang Scherr, Andrew S. Agbemenu, Santiago Martin Sondón, Johannes Sturm, Vinayak Hande